脉冲镀铜 填通空 填盲孔 TGV TSV

特性和优点

1. MC-1200是一种酸性镀铜添加剂系统，专门针对连续生产的脉冲周期性反整流进行了优化；

2. 这一过程产生了一种细粒的、韧性的、具有良好分布特征的沉积物，并由两部分组成；

3. MC-1200和周期性反脉冲电镀整流器的组合可以显著缩短电镀时间，同时保持良好的镀铜层厚度分布比；

4. 尤其适合纵横比在20:1的印制电路板；

1. MC-1200 is an acid copper plating additive system that has been specifically optimized for use with pulse periodic reverse rectification on a continual production basis；

2. The process produces a fine-grained, ductile deposit with excellent distribution characteristics, and is maintained with two components；

3. The combination of MC-1200 and a periodic reverse pulse plating rectifier can significantly shorten plating times while maintaining excellent copper thickness distribution ratios；

4. Especially suitable for printed circuit boards with an aspect ratio of 20:1；